In addition to the typical requirement faced by engineers 
to package electronic components and systems into 
increasingly small enclosures, avoiding failure and 
detrimental performance due to overheating is particularly 
challenging when:

* Other considerations preclude the use of fans and place 
restrictions on grille design
* Your rack-mounted module is competing for air flow in a 
crowded chassis
* You need to design against fan outage

Computational fluid dynamics (CFD) is an invaluable 
technique to quantify component temperatures and visualise 
air flow. ANSYS Icepak is a CFD-based simulation tool 
specifically designed for the electronics industry, 
enabling engineers to maximise the use of available air 
flows and keep temperature-sensitive components within an 
acceptable envelope.

Agenda
* Wilde Analysis within the electronics industry
* How can simulation save costs and add value?
* Overview of ANSYS Icepak
* Applications 
  o Heat sink and cooling fan selection and sizing
  o Layout optimisation
  o Performance in working environments
  o Supporting reliability analysis
* Q&A Session

Who Should Attend

* Mechanical Design Engineers and Managers involved in 
Electronics packaging
* Electrical/Electronics Designers
* Reliability Engineers
* Project Managers

Registration / Further Information

Simply choose one of the following options to reserve your 
free place:

* Complete the registration form on our website 
* Call us on +44 (0)161 4747479
* Email us at events@wildeanalysis.co.uk

To find out more about our software and services, 
please contact us on +44 (0) 161 4747479 or email 
events@wildeanalysis.co.uk