CFD Events Calendar, Event Record #20364
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Thermal Characterization of Electronic Components & Systems
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Spend the day with us learning about our measurement system
for the fast and very accurate thermal characterization of
electronic components and systems (IC packages, MOSFETS,
IGBTs, etc.)
You will also experience hands-on practical exercises with
the T3Ster Measurement System.
This one day event is offered free of charge. Complimentary
refreshments and lunch are provided.
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| Date: |
June 4, 2014
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| Location: |
Mentor Graphics (Deutschland) GmbH, Zettachring 4, D-70567 , Stuttgart, Germany
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| Web Page: |
http://www.mentor.com/products/mechanical/events/thermal-characterization-seminar
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| Organizer: |
Mentor Graphics (Deutschland) GmbH
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| Application Areas: |
Electronics Cooling, Automotive, Aerospace, Semiconductor Processing, General CFD, Computer Aided Design (CAD)
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| Type of Event: |
Seminar, Local
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| Description: |
Information Day - System Level Thermal Testing -
Measurement Methodology
Event dates, location and topic:
4 June 2014, Stuttgart: Power Electronics Reliability?
Start testing now, 1500A for a longer life
11 June 2014, Frankfurt: T3Ster can make your cars better:
Thermal testing in the Automotive Industry
16 September 2014, Stuttgart: Optimize your design flow:
Thermal Characterization & Simulation
16 October 2014, Stuttgart: Can not rely on vendor data?
Test Thermal Interface Materials with DynTIM
29 October 2014, Frankfurt: Optical data for thermal
simulation: The T3Ster-FloEFD solution
27 November 2014, Stuttgart: IGBT Reliability: 1500A closer
to solving your problems
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Event record first posted on May 7, 2014, last modified on May 10, 2014
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