Start Date/Time	29 Apr 14:00
End Date/Time	29 Apr 14:45

Understanding the thermal behaviour and associated 
structural response of a component is crucial to the 
design of an electronics product. From initial concept 
through to manufacturing, ANSYSsimulation plays its part 
in helping engineers eliminate under-performing 
proposals, while also providing non-invasive methods for 
performance assessments of potential designs.
Join us on Wednesday 29th April 2015, as we showcase 
ANSYS' multiphysics capabilities, relevant to electronics 
design:

o	Thermal analysis
o	Joule / resistive heating
o	Transient heat-up and cool-down
o	Structural response
o	Thermal induced stresses and deformations
o	High Acceleration, Shock and Impact Loadings
o	Multiphysics analysis coupling electromagnetics 
simulation, CFD and FEA - including the leading ANSYS 
Maxwell, Icepak, and Mechanical solvers
o	Model parameterisation for geometric dimensions 
and operational conditions
o	Modelling of fans, heat sinks, fins and other 
components within an electronics assembly
o	Integration with external CAD

The webinar will last 45 minutes, at the end of which 
there will be a short Q&A session answer any queries 
raised by the attendees.

Who Should Attend? 

This webinar will be of interest to managers and 
engineers' involved in the design and specification of 
electronic and electro-mechanical devices. 

To register, or for further information, please visit:
http://wildeanalysis.co.uk/events/2015/simulations-for-
thermal-and-structural-response-of-electronic-components

Alternatively, please contact us on 0161