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[Sponsors] |
Best practices for forced and natural convection cooling simulations | |
Basic sizing calculations, as well as the detailed simulation steps, will be covered to best equip the thermal engineer to effectively use simulation to aid and guide the demanding task of reliable system design. | |
Date: | December 15, 2016 |
Location: | http://www2.cd-adapco.com/l/14592/2016-11-30/6xy1wk |
Contact Email: | jay.dunstan@cd-adapco.com |
Organizer: | Siemens PLM |
Application Areas: | Electronics Cooling |
Type of Event: | Online Event, International |
Description: | |
The two most common cooling approaches for electronics devices are forced and natural convection cooling. Natural convection is often considered ideal because of its inherent reliability but is limited in its heat dissipation capability. Forced convection approaches introduce additional failure points, most notably with a fan, but the dramatic increase in heat dissipation possibly makes the additional risk acceptable. Thermal simulation is a key tool used by design engineers to both assess the cooling approaches available and to guide the detailed design of the system. This web seminar will explain the best practices for performing forced and natural convection simulations with leading simulation software. Basic sizing calculations, as well as the detailed simulation steps, will be covered to best equip the thermal engineer to effectively use simulation to aid and guide the demanding task of reliable system design. This online event is free, but registration is necessary to obtain log-in credentials. Please visit our event page for more information. |
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Event record first posted on December 5, 2016, last modified on December 5, 2016 |
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