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[Sponsors] |
What’s New in Simcenter Flotherm 2019.2 and Simcenter Flotherm XT 2019.3 | |
New enhancements to Simcenter Flotherm 2019.2 and Simcenter Flotherm XT 2019.3 electronics cooling software including: new results analysis mode and post processing automation; Simcenter Flotherm Package Creator, PCB copper thermal modeling options, and more. | |
Date: | January 30, 2020 |
Location: | Algeria |
Web Page: | https://www.mentor.com/products/mechanical/events/what-s-new-in-simcenter-flotherm-2019-2-and-simcenter-flotherm-xt-2019-3 |
Contact Email: | debbie_searle@mentor.com |
Organizer: | Mentor - A Siemens Business |
Application Areas: | Electronics Cooling |
Softwares: | FloTHERM XT, FloTHERM |
Type of Event: | Conference, International |
Description: | |
What’s New in Simcenter Flotherm 2019.2 and Simcenter Flotherm XT 2019.3 Learn about our extensive new enhancements such as the redesign of results analysis mode to access tabular and plots results faster, new post-processing automation that saves hours of engineering time and how transient simulation power control works using multiple temperature sensor points plus more topics. Also, discover new Simcenter Flotherm Package Creator for fast, easy creation of package thermal models that is a step change in capability. Additionally, learn more about improving PCB thermal modeling using a new method, Material Mapping, to represent copper trace and content efficiently while maintaining suitable accuracy. For more information or to sign up, click here. |
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Event record first posted on January 13, 2020, last modified on January 17, 2020 |
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